Wire bond free connection of high frequency piezoelectric ultrasound transducer arrays

Anne Bernassau; David Hutson; Sandy Cochran; Mark P. Desmulliez

Wire bond free connection of high frequency piezoelectric ultrasound transducer arrays

Anne Bernassau (Inventor)
, David Hutson (Inventor)
, Sandy Cochran (Inventor)
, Mark P. Desmulliez (Inventor)

Research output: Patent

Abstract

A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component.

Original language	English
Patent number	US2013/0020907
Publication status	Published - 24 Jan 2013

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title = "Wire bond free connection of high frequency piezoelectric ultrasound transducer arrays",

abstract = "A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component.",

author = "Anne Bernassau and David Hutson and Sandy Cochran and Desmulliez, \{Mark P.\}",

year = "2013",

month = jan,

day = "24",

language = "English",

type = "Patent",

note = "US2013/0020907",

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TY - PAT

T1 - Wire bond free connection of high frequency piezoelectric ultrasound transducer arrays

AU - Bernassau, Anne

AU - Hutson, David

AU - Cochran, Sandy

AU - Desmulliez, Mark P.

PY - 2013/1/24

Y1 - 2013/1/24

N2 - A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component.

AB - A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component.

M3 - Patent

M1 - US2013/0020907

ER -

Wire bond free connection of high frequency piezoelectric ultrasound transducer arrays

Abstract

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