TY - JOUR
T1 - Simulation and optimization of film thickness uniformity in physical vapor deposition
AU - Wang, Ben
AU - Xiuhua, Fu
AU - Song, Shigeng
AU - Chu, Hin On
AU - Gibson, Desmond
AU - Li, Cheng
AU - Shi, Yongjing
PY - 2018/9/16
Y1 - 2018/9/16
N2 - Optimization of thin film uniformity is an important aspect for large-area coatings, particularly for optical coatings where error tolerances can be of the order of nanometers. Physical vapor deposition is a widely used technique for producing thin films. Applications include anti-reflection coatings, photovoltaics etc. This paper reviews the methods and simulations used for improving thin film uniformity in physical vapor deposition (both evaporation and sputtering), covering characteristic aspects of emission from material sources, projection/mask effects on film thickness distribution, as well as geometric and rotational influences from apparatus configurations. Following the review, a new program for modelling and simulating thin film uniformity for physical vapor deposition was developed using MathCAD. Results from the program were then compared with both known theoretical analytical equations of thickness distribution and experimental data, and found to be in good agreement. A mask for optimizing thin film thickness distribution designed using the program was shown to improve thickness uniformity from ±4% to ±0.56%
AB - Optimization of thin film uniformity is an important aspect for large-area coatings, particularly for optical coatings where error tolerances can be of the order of nanometers. Physical vapor deposition is a widely used technique for producing thin films. Applications include anti-reflection coatings, photovoltaics etc. This paper reviews the methods and simulations used for improving thin film uniformity in physical vapor deposition (both evaporation and sputtering), covering characteristic aspects of emission from material sources, projection/mask effects on film thickness distribution, as well as geometric and rotational influences from apparatus configurations. Following the review, a new program for modelling and simulating thin film uniformity for physical vapor deposition was developed using MathCAD. Results from the program were then compared with both known theoretical analytical equations of thickness distribution and experimental data, and found to be in good agreement. A mask for optimizing thin film thickness distribution designed using the program was shown to improve thickness uniformity from ±4% to ±0.56%
KW - thin film uniformity
KW - physical vapour deposition
KW - thin film modelling
KW - thickness distribution
UR - http://www.mdpi.com/2079-6412/8/9/325
U2 - 10.3390/coatings8090325
DO - 10.3390/coatings8090325
M3 - Article
SN - 2079-6412
VL - 8
JO - Coatings
JF - Coatings
IS - 9
M1 - 325
ER -