Integration Techniques for Micro/Nanostructure-Based Large-Area Electronics

Carlos García Núñez, Fengyuan Liu, Sheng Xu, Ravinder Dahiya

Research output: Book/ReportBook

Abstract

Advanced nanostructured materials such as organic and inorganic micro/nanostructures are excellent building blocks for electronics, optoelectronics, sensing, and photovoltaics because of their high-crystallinity, long aspect-ratio, high surface-to-volume ratio, and low dimensionality. However, their assembly over large areas and integration in functional circuits are a matter of intensive investigation. This Element provides detailed description of various technologies to realize micro/nanostructures based large-area electronics (LAE) devices on rigid or flexible/stretchable substrates. The first section of this Element provides an introduction to the state-of-the-art integration techniques used to fabricate LAE devices based on different kind of micro/nanostructures. The second section describes inorganic and organic micro/nanostructures, including most common and promising synthesis procedures. In the third section,different techniques are explained that have great potential for integration of micro/nanostructures over large areas. Finally, the fourth section summarizes important remarks about LAE devices based on micro/nanostructures, and future directions.
Original languageEnglish
PublisherCambridge University Press
ISBN (Print)9781108703529
DOIs
Publication statusPublished - Nov 2018
Externally publishedYes

Publication series

NameElements in Flexible and Large-Area Electronics
PublisherCambridge University Press

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Keywords

  • Integration
  • Nanotechnology
  • Printing Electronics
  • Nanostructures
  • Microstructures
  • Organic Electronics
  • Inorganic Electronics
  • Semiconductors
  • Large area flexible electronics

Cite this

García Núñez, C., Liu, F., Xu, S., & Dahiya, R. (2018). Integration Techniques for Micro/Nanostructure-Based Large-Area Electronics. (Elements in Flexible and Large-Area Electronics). Cambridge University Press. https://doi.org/10.1017/9781108691574