Critical depth of cut in vertical diamond grinding

V.C. Venkatesh, S. Izman, T.T. Mon, P.S. Vichare

Research output: Chapter in Book/Report/Conference proceedingConference contribution


A critical depth of cut model for vertical spindle surface gnnding 1s proposed. A
diamond wheel of 5mm diameter, normally used for internal grinding, 1s used here
to do the surface-grinding test on Pyrex and BK7 glass An undeformed chip
thickness model has been developed and verified An earlier these two models
have a mutual relationship in this grinding mechanism The critical depth of cut
model conforms to the expenmental result, and the model developed by Bifano et
al was used for venfication Taking into cons1derat1on the accuracy of each model,
the proposed model appears to be in agreement with other models since it gives
similar results
Original languageEnglish
Title of host publicationProceedings of the 21st All India Manuacturing Technology Design Conference
Subtitle of host publicationInnovating the Future through Manufacturing
Number of pages6
Publication statusPublished - 2004
Externally publishedYes


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