Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

A. L. Bernassau; D. Hutson; C. E. M. Demore; S. Cochran

doi:10.1109/ULTSYM.2008.0016

Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

A. L. Bernassau, D. Hutson, C. E. M. Demore, S. Cochran

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.

Original language	English
Title of host publication	2008 IEEE Ultrasonics Symposium
Pages	62-65
Number of pages	4
DOIs	https://doi.org/10.1109/ULTSYM.2008.0016
Publication status	Published - 2008
Externally published	Yes
Event	2008 IEEE Ultrasonics Symposium - Beijing, China Duration: 2 Nov 2008 → 5 Nov 2008

Publication series

Name	ULTRASONICS SYMPOSIUM

Conference

Conference	2008 IEEE Ultrasonics Symposium
Country/Territory	China
City	Beijing
Period	2/11/08 → 5/11/08

Keywords

Epoxy adhesive
cure temperature
material properties
acoustic properties
high frequency array
photolithography

Access to Document

10.1109/ULTSYM.2008.0016

Cite this

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title = "Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes",

abstract = "High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.",

keywords = "Epoxy adhesive, cure temperature, material properties, acoustic properties, high frequency array, photolithography",

author = "Bernassau, {A. L.} and D. Hutson and Demore, {C. E. M.} and S. Cochran",

year = "2008",

doi = "10.1109/ULTSYM.2008.0016",

language = "English",

isbn = "978-1-4244-2428-3",

series = "ULTRASONICS SYMPOSIUM",

pages = "62--65",

booktitle = "2008 IEEE Ultrasonics Symposium",

note = " 2008 IEEE Ultrasonics Symposium ; Conference date: 02-11-2008 Through 05-11-2008",

}

TY - GEN

T1 - Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

AU - Bernassau, A. L.

AU - Hutson, D.

AU - Demore, C. E. M.

AU - Cochran, S.

PY - 2008

Y1 - 2008

N2 - High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.

AB - High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.

KW - Epoxy adhesive

KW - cure temperature

KW - material properties

KW - acoustic properties

KW - high frequency array

KW - photolithography

U2 - 10.1109/ULTSYM.2008.0016

DO - 10.1109/ULTSYM.2008.0016

M3 - Conference contribution

SN - 978-1-4244-2428-3

T3 - ULTRASONICS SYMPOSIUM

SP - 62

EP - 65

BT - 2008 IEEE Ultrasonics Symposium

T2 - 2008 IEEE Ultrasonics Symposium

Y2 - 2 November 2008 through 5 November 2008

ER -

Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

Abstract

Publication series

Conference

Keywords

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