Abstract
The aim of this research work is to use Acoustic Emission (AE) technique for Structural Health Monitoring of engineering structures. AE is a non-destructive technique that monitors defect creation within a material through the detection and analysis of elastic waves under load condition. AE is fundamentally different from other non-destructive testing methods because it passively detects acoustic signals released from a material, whereas other methods require an energy input for the defect to be detected (i.e., x-rays, and ultrasound). The technique can also allow defect source location.
This research paper includes monitoring of AE events using commercially available bulk acoustic transducers (UT-1000) and thin film transducers which are a new dimension in the field of structural health monitoring. The main aspects of our research work include: fabrication and characterization of thin film transducers, design and development of AE prototype system, conducting AE experiments on a thin plate like specimens, analysis of raw AE data collected from both type of transducers using Fast Fourier Transform analysis, Wavelet analysis, plate wave analysis, AE source location in linear and trilateration pattern and comparison of Signal to Noise ratio of the two types of transducers.
This research paper includes monitoring of AE events using commercially available bulk acoustic transducers (UT-1000) and thin film transducers which are a new dimension in the field of structural health monitoring. The main aspects of our research work include: fabrication and characterization of thin film transducers, design and development of AE prototype system, conducting AE experiments on a thin plate like specimens, analysis of raw AE data collected from both type of transducers using Fast Fourier Transform analysis, Wavelet analysis, plate wave analysis, AE source location in linear and trilateration pattern and comparison of Signal to Noise ratio of the two types of transducers.
Original language | English |
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Number of pages | 13 |
Publication status | Published - 13 Jun 2017 |
Event | 1st World Congress on Condition Monitoring - ILEC Conference Centre, London, United Kingdom Duration: 13 Jun 2017 → 16 Jun 2017 http://www.bindt.org/events/PastEvents/WCCM-2017/ (Conference website) |
Conference
Conference | 1st World Congress on Condition Monitoring |
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Abbreviated title | WCCM 2017 |
Country/Territory | United Kingdom |
City | London |
Period | 13/06/17 → 16/06/17 |
Internet address |
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