Analysis of acoustic emission data for structural health monitoring of engineering geometries

A.A. Ghouri, K.J. Kirk

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

The aim of this research work is to use Acoustic Emission (AE) technique for Structural Health Monitoring of engineering structures. AE is a non-destructive technique that monitors defect creation within a material through the detection and analysis of elastic waves under load condition. AE is fundamentally different from other non-destructive testing methods because it passively detects acoustic signals released from a material, whereas other methods require an energy input for the defect to be detected (i.e., x-rays, and ultrasound). The technique can also allow defect source location.
This research paper includes monitoring of AE events using commercially available bulk acoustic transducers (UT-1000) and thin film transducers which are a new dimension in the field of structural health monitoring. The main aspects of our research work include: fabrication and characterization of thin film transducers, design and development of AE prototype system, conducting AE experiments on a thin plate like specimens, analysis of raw AE data collected from both type of transducers using Fast Fourier Transform analysis, Wavelet analysis, plate wave analysis, AE source location in linear and trilateration pattern and comparison of Signal to Noise ratio of the two types of transducers.
Original languageEnglish
Number of pages13
Publication statusPublished - 13 Jun 2017
Event1st World Congress on Condition Monitoring - ILEC Conference Centre, London, United Kingdom
Duration: 13 Jun 201716 Jun 2017
http://www.bindt.org/events/PastEvents/WCCM-2017/ (Conference website)

Conference

Conference1st World Congress on Condition Monitoring
Abbreviated titleWCCM 2017
CountryUnited Kingdom
CityLondon
Period13/06/1716/06/17
Internet address

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Ghouri, A. A., & Kirk, K. J. (2017). Analysis of acoustic emission data for structural health monitoring of engineering geometries. Paper presented at 1st World Congress on Condition Monitoring, London, United Kingdom.