A comparison between DCMS, HiPIMS and a novel ‘HiPIMS+Kick’ deposition for piezoelectric thin-films

Mhairi Rogan, John O'Donnell, Jason Hrebik, Nick Franzer, Rob Belan, Des Gibson, Kevin L. McAughey, David A. Hughes

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Abstract

High power impulse magnetron sputtering (HiPIMS) has been shown to improve optical and semi-conductor thin-film coatings through increased density [1], crystallinity and more control over deposition parameters [2]. Here, HiPIMS and, a new technique, HiPIMS + ‘Kick’ are investigated in relation to deposited piezoelectric coatings and compared with a standard DCMS coating. To assess improvements for acoustic generation, these films have been characterized using SEM and XRD techniques for material parameters, simulations have been done to model acoustic output and further work is to be done to find d33 parameters.
Original languageEnglish
Title of host publication2019 IEEE International Ultrasonics Symposium, IUS 2019
PublisherIEEE
Pages2616-2619
Number of pages4
ISBN (Electronic)9781728145969, 9781728145952
ISBN (Print)9781728145976
DOIs
Publication statusPublished - 31 Oct 2019

Publication series

NameIEEE Conference Proceedings
PublisherIEEE
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

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impulses
magnetron sputtering
coatings
thin films
acoustics
crystallinity
conductors
scanning electron microscopy
output
simulation

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Rogan, M., O'Donnell, J., Hrebik, J., Franzer, N., Belan, R., Gibson, D., ... Hughes, D. A. (2019). A comparison between DCMS, HiPIMS and a novel ‘HiPIMS+Kick’ deposition for piezoelectric thin-films. In 2019 IEEE International Ultrasonics Symposium, IUS 2019 (pp. 2616-2619). [8925581] (IEEE Conference Proceedings). IEEE. https://doi.org/10.1109/ULTSYM.2019.8925581
Rogan, Mhairi ; O'Donnell, John ; Hrebik, Jason ; Franzer, Nick ; Belan, Rob ; Gibson, Des ; McAughey, Kevin L. ; Hughes, David A. / A comparison between DCMS, HiPIMS and a novel ‘HiPIMS+Kick’ deposition for piezoelectric thin-films. 2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE, 2019. pp. 2616-2619 (IEEE Conference Proceedings).
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title = "A comparison between DCMS, HiPIMS and a novel ‘HiPIMS+Kick’ deposition for piezoelectric thin-films",
abstract = "High power impulse magnetron sputtering (HiPIMS) has been shown to improve optical and semi-conductor thin-film coatings through increased density [1], crystallinity and more control over deposition parameters [2]. Here, HiPIMS and, a new technique, HiPIMS + ‘Kick’ are investigated in relation to deposited piezoelectric coatings and compared with a standard DCMS coating. To assess improvements for acoustic generation, these films have been characterized using SEM and XRD techniques for material parameters, simulations have been done to model acoustic output and further work is to be done to find d33 parameters.",
author = "Mhairi Rogan and John O'Donnell and Jason Hrebik and Nick Franzer and Rob Belan and Des Gibson and McAughey, {Kevin L.} and Hughes, {David A.}",
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doi = "10.1109/ULTSYM.2019.8925581",
language = "English",
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Rogan, M, O'Donnell, J, Hrebik, J, Franzer, N, Belan, R, Gibson, D, McAughey, KL & Hughes, DA 2019, A comparison between DCMS, HiPIMS and a novel ‘HiPIMS+Kick’ deposition for piezoelectric thin-films. in 2019 IEEE International Ultrasonics Symposium, IUS 2019., 8925581, IEEE Conference Proceedings, IEEE, pp. 2616-2619. https://doi.org/10.1109/ULTSYM.2019.8925581

A comparison between DCMS, HiPIMS and a novel ‘HiPIMS+Kick’ deposition for piezoelectric thin-films. / Rogan, Mhairi; O'Donnell, John; Hrebik, Jason; Franzer, Nick; Belan, Rob; Gibson, Des; McAughey, Kevin L.; Hughes, David A.

2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE, 2019. p. 2616-2619 8925581 (IEEE Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Rogan M, O'Donnell J, Hrebik J, Franzer N, Belan R, Gibson D et al. A comparison between DCMS, HiPIMS and a novel ‘HiPIMS+Kick’ deposition for piezoelectric thin-films. In 2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE. 2019. p. 2616-2619. 8925581. (IEEE Conference Proceedings). https://doi.org/10.1109/ULTSYM.2019.8925581