A comparison between DCMS, HiPIMS and a novel 'HiPIMS plus Kick' deposition for piezoelectric thin-films

Mhairi Rogan, John O'Donnell, Jason Hrebik, Nick Franzer, Rob Belan, Des Gibson, Kevin L. McAughey, David A. Hughes

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High power impulse magnetron sputtering (HiPIMS) has been shown to improve optical and semi-conductor thin-film coatings through increased density [1], crystallinity and more control over deposition parameters [2]. Here, HiPIMS and, a new technique, HiPIMS + `Kick' are investigated in relation to deposited piezoelectric coatings and compared with a standard DCMS coating. To assess improvements for acoustic generation, these films have been characterized using SEM and XRD techniques for material parameters, simulations have been done to model acoustic output and further work is to be done to find d33 parameters.
Original languageEnglish
Title of host publication2019 IEEE International Ultrasonics Symposium (IUS)
PublisherIEEE
Pages2616-2619
Number of pages4
ISBN (Electronic)9781728145969, 9781728145952
ISBN (Print)9781728145976
DOIs
Publication statusPublished - 19 Dec 2019
Event2019 IEEE International Ultrasonics Symposium - Glasgow, United Kingdom
Duration: 6 Oct 20199 Oct 2019

Publication series

Name2019 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS)
ISSN (Print)1948-5719

Conference

Conference2019 IEEE International Ultrasonics Symposium
Abbreviated titleIEEE IUS 2019
CountryUnited Kingdom
CityGlasgow
Period6/10/199/10/19

Keywords

  • Thin-films
  • Materials
  • HiPIMS

Cite this

Rogan, M., O'Donnell, J., Hrebik, J., Franzer, N., Belan, R., Gibson, D., McAughey, K. L., & Hughes, D. A. (2019). A comparison between DCMS, HiPIMS and a novel 'HiPIMS plus Kick' deposition for piezoelectric thin-films. In 2019 IEEE International Ultrasonics Symposium (IUS) (pp. 2616-2619). (2019 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS)). IEEE. https://doi.org/10.1109/ULTSYM.2019.8925581