2F-5 Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

A. L. Bernassau, S. McKay, D. Hutson, C. E. M. Demore, L. Garcia-Gancedo, T. W. Button, J. J. McAneny, S. Cochran

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 mum element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.
Original languageEnglish
Title of host publication2007 IEEE Ultrasonics Symposium Proceedings
PublisherIEEE
Pages96-99
Number of pages4
ISBN (Electronic)978-1-4244-1384-3
ISBN (Print)978-1-4244-1383-6
DOIs
Publication statusPublished - 2007
Externally publishedYes
Event2007 IEEE Ultrasonics Symposium Proceedings - New York, United States
Duration: 28 Oct 200731 Oct 2007

Publication series

NameUltrasonics Symposium

Conference

Conference2007 IEEE Ultrasonics Symposium Proceedings
CountryUnited States
CityNew York
Period28/10/0731/10/07

Keywords

  • 1-3 piezocomposite
  • high frequency array
  • lapping
  • polishing
  • microfabrication
  • photolithography

Cite this

Bernassau, A. L., McKay, S., Hutson, D., Demore, C. E. M., Garcia-Gancedo, L., Button, T. W., ... Cochran, S. (2007). 2F-5 Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays. In 2007 IEEE Ultrasonics Symposium Proceedings (pp. 96-99). (Ultrasonics Symposium). IEEE. https://doi.org/10.1109/ULTSYM.2007.37
Bernassau, A. L. ; McKay, S. ; Hutson, D. ; Demore, C. E. M. ; Garcia-Gancedo, L. ; Button, T. W. ; McAneny, J. J. ; Cochran, S. / 2F-5 Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays. 2007 IEEE Ultrasonics Symposium Proceedings. IEEE, 2007. pp. 96-99 (Ultrasonics Symposium).
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title = "2F-5 Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays",
abstract = "A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 mum element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.",
keywords = "1-3 piezocomposite, high frequency array, lapping, polishing, microfabrication, photolithography",
author = "Bernassau, {A. L.} and S. McKay and D. Hutson and Demore, {C. E. M.} and L. Garcia-Gancedo and Button, {T. W.} and McAneny, {J. J.} and S. Cochran",
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Bernassau, AL, McKay, S, Hutson, D, Demore, CEM, Garcia-Gancedo, L, Button, TW, McAneny, JJ & Cochran, S 2007, 2F-5 Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays. in 2007 IEEE Ultrasonics Symposium Proceedings. Ultrasonics Symposium, IEEE, pp. 96-99, 2007 IEEE Ultrasonics Symposium Proceedings, New York, United States, 28/10/07. https://doi.org/10.1109/ULTSYM.2007.37

2F-5 Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays. / Bernassau, A. L.; McKay, S.; Hutson, D.; Demore, C. E. M.; Garcia-Gancedo, L.; Button, T. W.; McAneny, J. J.; Cochran, S.

2007 IEEE Ultrasonics Symposium Proceedings. IEEE, 2007. p. 96-99 (Ultrasonics Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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T1 - 2F-5 Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

AU - Bernassau, A. L.

AU - McKay, S.

AU - Hutson, D.

AU - Demore, C. E. M.

AU - Garcia-Gancedo, L.

AU - Button, T. W.

AU - McAneny, J. J.

AU - Cochran, S.

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N2 - A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 mum element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

AB - A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 mum element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

KW - 1-3 piezocomposite

KW - high frequency array

KW - lapping

KW - polishing

KW - microfabrication

KW - photolithography

U2 - 10.1109/ULTSYM.2007.37

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M3 - Conference contribution

SN - 978-1-4244-1383-6

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BT - 2007 IEEE Ultrasonics Symposium Proceedings

PB - IEEE

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Bernassau AL, McKay S, Hutson D, Demore CEM, Garcia-Gancedo L, Button TW et al. 2F-5 Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays. In 2007 IEEE Ultrasonics Symposium Proceedings. IEEE. 2007. p. 96-99. (Ultrasonics Symposium). https://doi.org/10.1109/ULTSYM.2007.37