GOLD MEDAL: Novel Bondless Diamond Grinding Wheel for Fine Finishing of Si Die and Chip Packaging for Failure Analysis and for Generating Aspheric Glass Lenses. IPTA R&D EXPO 2005, PWTC, Kuala Lumpur (30 Sep – 2 Oct, 2005). V.C. Venkatesh, S. Izman & P.S. Vichare